Thermographies V2
[2021-2025]
Thermography of a processor.
Installation : variable dimensions.
- « System » : Raspberry Pi, thermal camera, LCD screen, speaker, aluminum, brass. Electronic device.
- « Models » : 3D prints of analysis models. 10 pieces (5 x 5 cm) in PLA with backlighting, 125 x 12 x 5 cm.
- « Loop » : Display of thermal images. LED matrix, electronic device, 21 x 21 x 5 cm.
- « Reconstructions » : Printing of three-dimensional models of thermal variations. Gelatin silver acetate mounted on Plexiglas. 12 pieces, 9 x 9 cm.
This installation is a series of experiments employing thermography to reveal the physical imprint and energy traces of a computational process.
The images processed are those of a computer in operation. Heat variations in a processor are recorded using a thermal camera. After being stored, the thermal images are treated and analyzed by an algorithm using an artificial neural network, then reintroduced into the algorithmic loop. The computational activity of the system is made visible by the thermal signature of its components. Thermography is used here as a means of revealing the friction between the software and the hardware.
To represent the different stages of the operation process, the installation is composed of four elements: System, Models, Loop, Reconstructions.
Experiments conducted in collaboration with Pierre Kerfriden (SIMS – Materials Center, Mines Paris) and initiated as part of the SACRe-PSL / EnsAD doctoral program.
